SPII

SPECIAL TOPICII (Chip Failure Analysis)

Course Overview

Semiconductor Devices and Properties Study. Material Properties and Packaging Technology. Including, chip protection methods.

Price FREE

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Last Updated On 14 September 2007

3 Downloadable Resources

Course Content

Start Date: 10/02/07
Category: Electrical Engineering

General

News forum
Liturature Surveys

10 February - 16 February

Causes for flip-chip failure
Liturature Surveys
Flipchip

17 February - 23 February

PCB Technology
Introduction

24 February - 2 March

3 March - 9 March

10 March - 16 March

17 March - 23 March

24 March - 30 March

31 March - 6 April

7 April - 13 April

14 April - 20 April

Enrolment options

SPECIAL TOPICII (Chip Failure Analysis)

Semiconductor Devices and Properties Study. Material Properties and Packaging Technology. Including, chip protection methods.

Skill Level: Beginner

Price FREE

Enrol Now

Last Updated On 14 September 2007

3 Downloadable Resources

Course Features

Lectures11
Start Date10 Feb 2007
Skill level Beginner
Language English

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